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M.M.R. Howlader, Tadatomo Suga and Moon J. Kim, “A Novel Bonding Method for Ionic Wafers”, IEEE Transactions Advanced Packaging , Nov.2007 Page(s):598-604 赖欣怡，国立清华大学材料科学与工程研究所硕士论文，“晶圆直接接合制程物理及化学机制讨论”，民国九十二年六月。