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The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed. 從全自動劃片機的工作機理出發，分析空氣靜壓電主軸、晶圓傳輸定位、自動對準、自動清洗等全自動劃片機的關鍵技術；